Kay Cooksey, Ph.D.
Professor and Cryovac Endowed Chair, Food, Nutrition and Packaging Sciences Department
Dr. Kay Cooksey is a Professor and is the Cryovac Endowed Chair in the Packaging Science Program at Clemson University. She joined the faculty at Clemson University in October 1998 after working at University of Wisconsin-Stout for 5 ½ years. Dr. Cooksey was a faculty intern at Dupont Packaging and Industrial Polymers Division and had the honor of receiving the Reister-Davis Lifetime Achievement Award from the Food Packaging Division of the Institute of Food Technologists in 2010. Her research focuses on food and packaging interactions and includes active packaging (specifically antimicrobial), biopolymer packaging and shelf life studies and sustainable packaging.